From Midas Technology of course! It’s always a surprise to see companies still using the ‘ol hammer and chisel when it comes to microelectronic rework. The Midas Technology HGRS-V (Hot Gas Rework Station evolution 5) makes component removal a breeze. Even high temperature Au/Sn attach removal can be done in less than 30 seconds in most instances. Imagine component removal without mechanically destroying adjacent components or gouging a metalized or otherwise populated substrate!
With dual nozzles and temperature capabilities adjustable upwards of 800oC components and daughter boards come up near effortlessly.
No need to worry about overheating adjacent components either. With two easily adjustable built-in nitrogen cooling jets you can protect what works in the device while heating up and removing what doesn’t. The HGRS-V also comes with a 6”2 universal work stage and a mechanical push tool to aid in component removal. For a hard copy or pdf data sheet on the HGRS-V please click here:
