Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes of product. SST has now filled that void nicely with a table top version. With a maximum temperature of 450^oC and recommended work area of 3.5”², the model 1200 gives any R&D or engineering lab the ability to prove out prototypes and low volumes before turning them over to a 3130 for production. Reflowing solders and eutectics starting in a vacuum and transitioning to a pressurized chamber while still liquidous is the key. The process compacts any voids that might be present, facilitating their movement out from under the component. This increases both electrical conductivity and heat dissipation. For hard copy or pdf literature on the SST International 1200 click here.