There are times when solid bonds (solder/eutectic/epoxy) simply aren’t possible in a heat sinking application. A Flip Chip backside to a hermetic lid interface for example. A copper or copper/tungsten heatsink base bolted to a block may preclude a solid attach. Yet intimate contact is what’s required to get the best thermal dissipation and electrical conductivity to the next component.

Soft Metal Alloy TIMs are in common use today, but are they in full contact – void free? Performing to the best of their ability?

Indium has solved the issue for critical thermal requirements with their patent pending Heat-Spring textured finish TIMs. Now it’s possible to use less thermal interface material with nodule like features that will either compress in tight locations, or reach out and grab your component where a gap might normally exist. Creating nodules in what once was merely a flat TIM promotes plastic deformation which will put more of our TIM in contact with your materials.

What are you waiting for – let’s get the heat out! For a brochure on Indium’s SMA Heat-Spring TIMs click here: