On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release

So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni foil that exothermically ignites at up to 2,000 degrees centigrade.  Place this foil between a component and a substrate, surrounded by a top and bottom layer of solder or eutectic, and you have the most locally isolated heat source capable of doing a complete solder or eutectic bond.

On October 26, 2009, Andie Mackie, Global Product Manager Semiconductor Assembly Materials, interviewed Tommy Acchione from RNT, as Tommy joined the Indium Corp team.  Click here for the Interview

While NanoFoil® is still very new to Indium, you can see a couple of very impressive application videos from RNT at Youtube.com.

A most rudimentary attach.  Two tinned copper pieces bonded with a piece of NanoFoil® alone:  Click here for Video

Bonding of a ten foot long sputter target:  Click here for Video

The microelectronic rework reattach potential alone is a very big application in itself.  What will you use NanoFoil® for?