We’re back with old friends. In 1983 when we first started as manufacturers’ representatives, Malcolm Cox was the U.S. Manager for a European equipment manufacturer. We had known Malcolm since 1980, only we were Malcolm’s customers back then. Malcolm hired us on to represent his line, but he left that company shortly afterward to [...]
Filed under: Ball Shear, Cold Bump Pull, Component Removal, Die Shear, Materials Testing, Microelectronic Rework, Wire Pull | Comment (0)
The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)