We’re back with old friends. In 1983 when we first started as manufacturers’ representatives, Malcolm Cox was the U.S. Manager for a European equipment manufacturer. We had known Malcolm since 1980, only we were Malcolm’s customers back then. Malcolm hired us on to represent his line, but he left that company shortly afterward to start [...]
Filed under: Ball Shear, Cold Bump Pull, Component Removal, Die Shear, Materials Testing, Microelectronic Rework, Wire Pull | Comment (0)
From Midas Technology of course! It’s always a surprise to see companies still using the ‘ol hammer and chisel when it comes to microelectronic rework. The Midas Technology HGRS-V (Hot Gas Rework Station evolution 5) makes component removal a breeze. Even high temperature Au/Sn attach removal can be done in less than 30 seconds in [...]
Filed under: Component Removal, Die Shear, Microelectronic Rework | Comment (0)