On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni [...]

SST International announces the release of the new Model 5100 Programmable Vacuum/Pressure Furnace.  The system is designed to increase production capacity for electronic component manufacturers while still maintaining a high level of process control in a small footprint.
The innovative design starts with the large heated work zone on the Model 5100. The heated area has been increased to 144 [...]

There are times when solid bonds (solder/eutectic/epoxy) simply aren’t possible in a heat sinking application. A Flip Chip backside to a hermetic lid interface for example. A copper or copper/tungsten heatsink base bolted to a block may preclude a solid attach. Yet intimate contact is what’s required to get the best [...]

bring you to a whole different level! In a world were process repeatability and product consistency seem to be everything, how you could not use a flux coated preform in your assembly process? With Indium’s flux coated preforms, not only will you have the exact same solder volume from attach to attach, [...]

The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…

Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes [...]