The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)
Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes of product. SST has now [...]
Filed under: Die Attach, Hermetic Packaging, Hermetic Sealing, Hi Vacuum, MEMs, Substrate Attach | Comment (0)