We’re back with old friends. In 1983 when we first started as manufacturers’ representatives, Malcolm Cox was the U.S. Manager for a European equipment manufacturer. We had known Malcolm since 1980, only we were Malcolm’s customers back then. Malcolm hired us on to represent his line, but he left that company shortly afterward to start [...]
Filed under: Ball Shear, Cold Bump Pull, Component Removal, Die Shear, Materials Testing, Microelectronic Rework, Wire Pull | Comment (0)
If you are performing either destruct or non-destruct wire pull testing according to Mil-Std-883 method 2011.7 (Destructive Bond Pull Test) or method 2023.5 (Nondestructive Bond Pull) you are probably in need of a reliable source for wire bond pull hooks. Especially for that ever growing list of machines that are ‘no longer supported’ by the [...]
Filed under: Ball Shear, Die Shear, Materials Testing, Wire Pull | Comment (0)
The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)