On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni [...]

We’re back with old friends.  In 1983 when we first started as manufacturers’ representatives, Malcolm Cox was the U.S. Manager for a European equipment manufacturer.  We had known Malcolm since 1980, only we were Malcolm’s customers back then.  Malcolm hired us on to represent his line, but he left that company shortly afterward to [...]

Midas has just released their 5th generation of package delidder, the D5 Series. As you might expect, the D5 continues to advance the clean room capable hermetic package lid removal process. The D5 comes in 6”, 8” and 10” cutting models (D5L6, D5L8, & D5L10 respectively).
The D5 series works with all [...]

The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…

From Midas Technology of course! It’s always a surprise to see companies still using the ‘ol hammer and chisel when it comes to microelectronic rework. The Midas Technology HGRS-V (Hot Gas Rework Station evolution 5) makes component removal a breeze. Even high temperature Au/Sn attach removal can be done in less than 30 seconds in [...]