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	<title>LFG Micro</title>
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	<link>http://lfgmicro.com</link>
	<description>It&#039;s who gets there first that counts</description>
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		<title>Indium Corp Acquires NanoFoil®</title>
		<link>http://lfgmicro.com/2009/10/28/113/</link>
		<comments>http://lfgmicro.com/2009/10/28/113/#comments</comments>
		<pubDate>Thu, 29 Oct 2009 00:49:09 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Component Attach]]></category>
		<category><![CDATA[Die Attach]]></category>
		<category><![CDATA[Eutectic Preforms]]></category>
		<category><![CDATA[Microelectronic Rework]]></category>
		<category><![CDATA[Solder Preforms]]></category>
		<category><![CDATA[Substrate Attach]]></category>
		<category><![CDATA[Substrates]]></category>
		<category><![CDATA[Indium Corp]]></category>
		<category><![CDATA[Solder]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/?p=113</guid>
		<description><![CDATA[ On Sep 22, 2009 Indium Corporation announced:  &#8221;Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.&#8221; &#8212; Click here for Press Release
So what exactly is this NanoFoil®?  In brief, it&#8217;s a fully patented ~40 micron thick Al/Ni [...]]]></description>
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		<title>Royce Instruments signs LFG Micro</title>
		<link>http://lfgmicro.com/2009/04/02/royce-instruments-signs-lfg-micro/</link>
		<comments>http://lfgmicro.com/2009/04/02/royce-instruments-signs-lfg-micro/#comments</comments>
		<pubDate>Fri, 03 Apr 2009 02:57:45 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Ball Shear]]></category>
		<category><![CDATA[Cold Bump Pull]]></category>
		<category><![CDATA[Component Removal]]></category>
		<category><![CDATA[Die Shear]]></category>
		<category><![CDATA[Materials Testing]]></category>
		<category><![CDATA[Microelectronic Rework]]></category>
		<category><![CDATA[Wire Pull]]></category>
		<category><![CDATA[Die Sort]]></category>
		<category><![CDATA[Equipment]]></category>
		<category><![CDATA[Film Frame Loaders]]></category>
		<category><![CDATA[Gel-Pak Loaders]]></category>
		<category><![CDATA[Royce Instruments]]></category>
		<category><![CDATA[Tweezer Pull]]></category>
		<category><![CDATA[Waffle Pack Loaders]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/?p=86</guid>
		<description><![CDATA[ We&#8217;re back with old friends.  In 1983 when we first started as manufacturers&#8217; representatives, Malcolm Cox was the U.S. Manager for a European equipment manufacturer.  We had known Malcolm since 1980, only we were Malcolm&#8217;s customers back then.  Malcolm hired us on to represent his line, but he left that company shortly afterward to [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>SST International New Product Announcement</title>
		<link>http://lfgmicro.com/2008/12/31/sst-international-new-product-announcement/</link>
		<comments>http://lfgmicro.com/2008/12/31/sst-international-new-product-announcement/#comments</comments>
		<pubDate>Wed, 31 Dec 2008 17:00:16 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Component Attach]]></category>
		<category><![CDATA[Die Attach]]></category>
		<category><![CDATA[Hermetic Sealing]]></category>
		<category><![CDATA[MEMs]]></category>
		<category><![CDATA[Substrate Attach]]></category>
		<category><![CDATA[SST International]]></category>
		<category><![CDATA[Vacuum/Pressure]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/?p=64</guid>
		<description><![CDATA[ SST International announces the release of the new Model 5100 Programmable Vacuum/Pressure Furnace.  The system is designed to increase production capacity for electronic component manufacturers while still maintaining a high level of process control in a small footprint.
The innovative design starts with the large heated work zone on the Model 5100. The heated area has been increased to 144 [...]]]></description>
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		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Indium Advanced Thermal Interface Materials</title>
		<link>http://lfgmicro.com/2008/11/01/indium-advanced-thermal-interface-materials/</link>
		<comments>http://lfgmicro.com/2008/11/01/indium-advanced-thermal-interface-materials/#comments</comments>
		<pubDate>Sat, 01 Nov 2008 05:32:06 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Component Attach]]></category>
		<category><![CDATA[Die Attach]]></category>
		<category><![CDATA[Thermal Interface Materials]]></category>
		<category><![CDATA[Flip Chip]]></category>
		<category><![CDATA[Heat Spreader]]></category>
		<category><![CDATA[Indium Corp]]></category>
		<category><![CDATA[TIMs]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/2008/02/07/indium-advanced-thermal-interface-materials/</guid>
		<description><![CDATA[  There are times when solid bonds (solder/eutectic/epoxy) simply aren’t possible in a heat sinking application.  A Flip Chip backside to a hermetic lid interface for example. A copper or copper/tungsten heatsink base bolted to a block may preclude a solid attach.  Yet intimate contact is what’s required to get the best [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Century Seals delivers Hermetic Packages</title>
		<link>http://lfgmicro.com/2008/04/03/century-seals-delivers-hermetic-packages/</link>
		<comments>http://lfgmicro.com/2008/04/03/century-seals-delivers-hermetic-packages/#comments</comments>
		<pubDate>Thu, 03 Apr 2008 20:13:18 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Hermetic Packaging]]></category>
		<category><![CDATA[Hermetic Sealing]]></category>
		<category><![CDATA[Century Seals]]></category>
		<category><![CDATA[Glass-to-Metal Seals]]></category>
		<category><![CDATA[Microwave Packaging]]></category>
		<category><![CDATA[Relay Packaging]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/2008/04/03/century-seals-delivers-hermetic-packages/</guid>
		<description><![CDATA[ Whether your hermetic packaging needs are small to medium volumes, glass-to-metal sealing services, custom feed-thru pins, or just about any project involving hermetic glass to metal seals (sight-glasses for instance), Century Seals has the breadth of talent to do the job, and the cumulative experience of that staff is understated in the company name.  [...]]]></description>
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		<slash:comments>0</slash:comments>
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		<item>
		<title>Wire Bond Pull Test Hooks</title>
		<link>http://lfgmicro.com/2008/03/31/wire-bond-pull-hooks/</link>
		<comments>http://lfgmicro.com/2008/03/31/wire-bond-pull-hooks/#comments</comments>
		<pubDate>Tue, 01 Apr 2008 03:51:23 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Ball Shear]]></category>
		<category><![CDATA[Die Shear]]></category>
		<category><![CDATA[Materials Testing]]></category>
		<category><![CDATA[Wire Pull]]></category>
		<category><![CDATA[Dage]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/2008/03/31/wire-bond-pull-hooks/</guid>
		<description><![CDATA[  If you are performing either destruct or non-destruct wire pull testing according to Mil-Std-883 method 2011.7 (Destructive Bond Pull Test) or method 2023.5 (Nondestructive Bond Pull) you are probably in need of a reliable source for wire bond pull hooks.  Especially for that ever growing list of machines that are &#8216;no longer supported&#8217; [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Indium Corp BIG Wall Chart Returns!</title>
		<link>http://lfgmicro.com/2008/02/13/indium-corp-big-wall-chart-returns/</link>
		<comments>http://lfgmicro.com/2008/02/13/indium-corp-big-wall-chart-returns/#comments</comments>
		<pubDate>Wed, 13 Feb 2008 17:00:36 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Uncategorized]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/?p=76</guid>
		<description><![CDATA[    How many engineers have never seen this one in a lab?
The Indium Alloy chart is the de facto standard quick reference for everything solder and eutectic, and now it&#8217;s been completely updated!  At an enormous 33&#8243; x 39&#8243; in size, this one is easily readable, and referenced by many in an engineering lab or [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>The Long Look Back &#8211; 25 Years</title>
		<link>http://lfgmicro.com/2008/01/01/hello-world/</link>
		<comments>http://lfgmicro.com/2008/01/01/hello-world/#comments</comments>
		<pubDate>Tue, 01 Jan 2008 05:01:09 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Uncategorized]]></category>
		<category><![CDATA[Anniversary]]></category>
		<category><![CDATA[LFG Micro]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/?p=1</guid>
		<description><![CDATA[     Time moves quickly &#8212; sometimes too quickly.  We couldn&#8217;t have made it this far without being continually involved with a great group of PEOPLE.  It doesn&#8217;t matter if we see each other weekly, monthly, or even annually.  We look forward to working with you whenever the opportunity [...]]]></description>
		<wfw:commentRss>http://lfgmicro.com/2008/01/01/hello-world/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Riv Thick Film Screens Moves</title>
		<link>http://lfgmicro.com/2007/12/01/riv-thick-film-screens-moves/</link>
		<comments>http://lfgmicro.com/2007/12/01/riv-thick-film-screens-moves/#comments</comments>
		<pubDate>Sat, 01 Dec 2007 17:00:49 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Screen Printing]]></category>
		<category><![CDATA[Substrates]]></category>
		<category><![CDATA[Riv Inc]]></category>
		<category><![CDATA[Thick Film]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/2007/12/01/riv-thick-film-screens-moves/</guid>
		<description><![CDATA[  into a brand new facility more than doubling both its manufacturing space and capabilities.  The last ten years has been marked by a reduction in the number of thick film screen manufacturers left in the industry through consolidation.  As a direct result, Riv has experienced phenomenal growth from customers that prefer [...]]]></description>
		<wfw:commentRss>http://lfgmicro.com/2007/12/01/riv-thick-film-screens-moves/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Laser Processing Technology &amp; a Whole Lot More</title>
		<link>http://lfgmicro.com/2007/09/01/laser-processing-technology-a-whole-lot-more/</link>
		<comments>http://lfgmicro.com/2007/09/01/laser-processing-technology-a-whole-lot-more/#comments</comments>
		<pubDate>Sat, 01 Sep 2007 05:41:26 +0000</pubDate>
		<dc:creator>Admin</dc:creator>
				<category><![CDATA[Diamond Blade Sawing]]></category>
		<category><![CDATA[Laser Machining]]></category>
		<category><![CDATA[Laser Scribing]]></category>
		<category><![CDATA[Substrates]]></category>
		<category><![CDATA[AlN Substrates]]></category>
		<category><![CDATA[Alumina Substrates]]></category>
		<category><![CDATA[BeO Substrates]]></category>
		<category><![CDATA[Diamond Blade Dicing]]></category>
		<category><![CDATA[Laser Processing Technology]]></category>
		<category><![CDATA[Value Added Services]]></category>

		<guid isPermaLink="false">http://lfgmicro.com/2007/09/01/laser-processing-technology-a-whole-lot-more/</guid>
		<description><![CDATA[  Job number one at any laser shop catering to the microelectronic industry is providing Alumina,   Aluminum Nitride, and BeO substrates.  Laser Processing Technology (LPT) offers a whole lot more.  Sure they have 500 watt multi-head lasers that do laser scribe and machining of ceramics, metals, and laminates.  They [...]]]></description>
		<wfw:commentRss>http://lfgmicro.com/2007/09/01/laser-processing-technology-a-whole-lot-more/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
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