On Sep 22, 2009 Indium Corporation announced: ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®? In brief, it’s a fully patented ~40 micron thick Al/Ni [...]
Filed under: Component Attach, Die Attach, Eutectic Preforms, Microelectronic Rework, Solder Preforms, Substrate Attach, Substrates | Comment (0)
SST International announces the release of the new Model 5100 Programmable Vacuum/Pressure Furnace. The system is designed to increase production capacity for electronic component manufacturers while still maintaining a high level of process control in a small footprint.
The innovative design starts with the large heated work zone on the Model 5100. The heated area has been increased to 144 [...]
Filed under: Component Attach, Die Attach, Hermetic Sealing, MEMs, Substrate Attach | Comment (1)
bring you to a whole different level! In a world were process repeatability and product consistency seem to be everything, how you could not use a flux coated preform in your assembly process? With Indium’s flux coated preforms, not only will you have the exact same solder volume from attach to attach, [...]
Filed under: Component Attach, Die Attach, Eutectic Preforms, Solder Preforms, Substrate Attach | Comment (0)