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Posts tagged ‘Component Attach’

Indium Corp Acquires NanoFoil®

October 28th, 2009

On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni [...]

SST International announces the release of the new Model 5100 Programmable Vacuum/Pressure Furnace.  The system is designed to increase production capacity for electronic component manufacturers while still maintaining a high level of process control in a small footprint.
The innovative design starts with the large heated work zone on the Model 5100. The heated area has been increased to 144 [...]

bring you to a whole different level! In a world were process repeatability and product consistency seem to be everything, how you could not use a flux coated preform in your assembly process? With Indium’s flux coated preforms, not only will you have the exact same solder volume from attach to attach, [...]


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