If you are performing either destruct or non-destruct wire pull testing according to Mil-Std-883 method 2011.7 (Destructive Bond Pull Test) or method 2023.5 (Nondestructive Bond Pull) you are probably in need of a reliable source for wire bond pull hooks. Especially for that ever growing list of machines that are ‘no longer supported’ [...]
Filed under: Ball Shear, Die Shear, Materials Testing, Wire Pull | Comment (0)
The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)