On Sep 22, 2009 Indium Corporation announced: ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®? In brief, it’s a fully patented ~40 micron thick Al/Ni [...]
Filed under: Component Attach, Die Attach, Eutectic Preforms, Microelectronic Rework, Solder Preforms, Substrate Attach, Substrates | Comment (0)
Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes [...]
Filed under: Die Attach, Hermetic Packaging, Hermetic Sealing, Hi Vacuum, MEMs, Substrate Attach | Comment (0)