On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release
So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni [...]

There are times when solid bonds (solder/eutectic/epoxy) simply aren’t possible in a heat sinking application. A Flip Chip backside to a hermetic lid interface for example. A copper or copper/tungsten heatsink base bolted to a block may preclude a solid attach. Yet intimate contact is what’s required to get the best [...]

bring you to a whole different level! In a world were process repeatability and product consistency seem to be everything, how you could not use a flux coated preform in your assembly process? With Indium’s flux coated preforms, not only will you have the exact same solder volume from attach to attach, [...]