Time moves quickly — sometimes too quickly. We couldn’t have made it this far without being continually involved with a great group of PEOPLE. It doesn’t matter if we see each other weekly, monthly, or even annually. We look forward to working with you whenever the opportunity presents itself. In the 25 years we’ve been [...]
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The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)