SST International announces the release of the new Model 5100 Programmable Vacuum/Pressure Furnace. The system is designed to increase production capacity for electronic component manufacturers while still maintaining a high level of process control in a small footprint.
The innovative design starts with the large heated work zone on the Model 5100. The heated area has been increased to 144 [...]
Filed under: Component Attach, Die Attach, Hermetic Sealing, MEMs, Substrate Attach | Comment (1)
The half day symposium was well attended and as always, the weather was perfect for our post symposium social. Here are just a few photos from the day. Thank you to everyone that took the time to make this yet another great day in the Disseminate series…
Filed under: Ball Shear, Cold Bump Pull, Component Attach, Die Attach, Die Shear, Hermetic Sealing, Hi Vacuum, Materials Testing, Microelectronic Rework, Screen Printing, Substrate Attach, Tweezer Pull, Wire Pull | Comment (0)
Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes [...]
Filed under: Die Attach, Hermetic Packaging, Hermetic Sealing, Hi Vacuum, MEMs, Substrate Attach | Comment (0)