LFG Micro

Posts tagged ‘Substrate Attach’

Indium Corp Acquires NanoFoil®

October 28th, 2009

On Sep 22, 2009 Indium Corporation announced:  ”Indium Corporation (Indium) of Clinton, NY, today announced that it has acquired the processes, equipment, and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®.” — Click here for Press Release So what exactly is this NanoFoil®?  In brief, it’s a fully patented ~40 micron thick Al/Ni [...]

Furnaces are known world-wide for a variety of applications. One of the most common applications is flux-free, void-free component soldering. The older DAP, MV, and the now standard 3130 series models have high volume batch manufacturing capabilities. Up until now, there really wasn’t a machine for R&D and low volumes of product. SST has now [...]


© Copyright 1983-2008 LFG Micro. All rights reserved.