JFP Microtechnic
Since 1992 JFP has designed and built a stable of manual, semi-automatic, and fully automatic microelectronic assembly equipment. Engineering is what they do, and this includes special one-off customized equipment where the needs exist. Die Bonders; Wire Bonders; Scribers; Laser Stackers / Testers; and Inspection Equipment.
Kulicke & Soffa
Connections, specifically Interconnections. Microelectronic wire bonding these days is incredibly fast, at its lowest price point ever, reaching a reliability level never achieved before! Complimented by automated die bonding, automated dispensers employing pattern req, AOI, Jet, PCP, deposition, and ultrasonic spray Technologies., flip chip, TCB die attach or incorporated into the most capable cross-over SMT Pick & Place systems available today.
Midas Technology
Mission Critical Microelectronic Rework dominance. The ability to remove hermetic package lids inside a cleanroom, without introducing metal particulate into the cavity, is why Midas Delidders are industry standard.
The ability to remove both eutectic and epoxy mounted components and substrates from microelectronic modules makes Midas Technology the industry standard for in-package rework. A lower cost Single Jet Hot Gas system is geared more toward epoxies while the dual jet system is capable of removing Au/Sn eutectically bonded components and larger epoxy mounted components and substrates.
Stellar Industries
Custom Metallized Ceramic Substrates & Thermal Specialists. Al02, AlN, BeO for best CTE and W/MK output. Thin Film, Thick Film, Direct Bond Copper (DBC). MicroChannel Liquid Coolers and Cold Plates.
Kulicke & Soffa Table Top Wire Bonder Service, Hands-On Training, Parts & Supplies
Every bonder needs servicing. Preventive Maintenance and Bonder Performance Evaluations should be performed annually. Many ISO certifications require it.
K&S 4522, 4523, 4524, + 4526 ball and wedge bonder models were discontinued in 2016 but they are still highly reliable and fully maintainable wire bonders. The K&S table top wire bonders are all volume production workhorses responsible for many companies entire manufacturing efforts.
The 5000 ball and wedge models were designed and introduced by K&S in 2013. The 5000 is an all digital, PC based, using a 7″ touch screen for parameter entry and storage. The 5000 series wire bonders were the last table top wire bonder models manufactured by K&S.